2UUL GS158 JOINT X 158°C 50G SOLDER PASTE Low-Temperature Solder Paste: 2UUL GS158 Joint X melts at 158°C, reducing heat stress on sensitive PCB components Strong & Reliable Joints: Ensures excellent bonding strength and long-lasting solder connections Smooth & Stable Texture: Easy to apply with syringe or stencil, no splashing during heating High Wettability: Improves solder flow for clean and shiny joints Minimal Residue: Leaves low residue after soldering, easy to clean Wide Applications: Ideal for SMD, BGA reballing, IC repair, and mobile phone motherboard work Professional Grade Quality: Suitable for mobile repair shops, electronics labs, and advanced PCB repair Packaging: 50g sealed container, long shelf life and consistent performance
