* Melting Point: 138°C * Alloy: Sn96.5Ag3.0Cu0.5 * BGA solder paste high-temperature * Application: Mobile phone repair, computer and digital service industries, high-precision circuit board SMT soldering, BGA welding process, etc. * Joint high-intensity * Good immersion * Good insulating ability * Soldering paste for cell phone PCB and SMD like BGA, PGA, etc. * Help to repair the circuit boards and protect the electronic components * A necessary material for repairing the mobile phone mainboard